I have used the ultrasonic to clean, and heating pad method to flatten, a great many Paulsons. I have not tried either of these methods on BCCs.
Does anyone have any insight into using these methods on BCC chips? Do I need to do anything differently as compared to Paulsons?
I need to clean and flatten a bunch of BCC chips. Any help from anyone that has previously done this would be greatly appreciated. Thanks!
Does anyone have any insight into using these methods on BCC chips? Do I need to do anything differently as compared to Paulsons?
I need to clean and flatten a bunch of BCC chips. Any help from anyone that has previously done this would be greatly appreciated. Thanks!