superchromix
Full House
Hi,
Before you say it, I know there are other threads about chip flattening. The point of this thread will make itself clear, hopefully.
All of the commonly used chip flattening techniques are based on some variation of the "clamp" method - that is, put a barrel of warped chips in a clamp (possibly using ceramic blanks as spacers), tighten the clamp, and add heat. Wait for some time, re-tighten the clamp, remove the clamp from heat and allow to cool.
While this method is tried and tested, and no doubt works with some degree of success, it seems to have serious limitations. First of all, it's SLOW. The max number of chips that you can do at a time is one or two barrels, and the heating and cooling time also seems long. On top of that, it is very hard to control the parameters of the system, namely each person will tighten the clamp differently, and the chips will reach a different temperature depending on the particular oven or heating pad you are using, all depending on the air circulation around the chips because the chips are not actually in contact with anything which is thermally conductive.
HENCE, I am asking myself if there is a better way. A flattening method which would give reproducible results, and have a high enough throughput to flatten say 1000 chips in a couple of hours. Can it be done?
IF I know any group of people who are resourceful and goal driven, it's the chippers on this site. I'm sure it can be done. I even have an idea of how to do it. So, if you're interested, tell me what you think of this idea.
------------------------------
CONCEPT: Chip flattening device.
Working principle: Gravity.
Description: 1. Flat metal baseplate with circular recesses, each of which have a depth of ~ 1/2 a chip thickness. Places for 25 or 50 chips. 2. Flat metal top plate of matching size.
Operation: 1. Heat base plate and top plate in oven or on heat pad until a certain temperature is reached. 2. Place warped chips in circular recesses. 3. Place heavy metal top plate on top of chips. 4. Wait a certain period of time while chips are flattened by pressure of top plate, while absorbing heat from the two plates. 5. Remove chips.
------------------------------
What I like about the concept:
-- Gravity is doing the work - the force on the chips will always be the same, just the weight of the top plate. No variation due to how tight you tightened the clamp.
-- The heat can be controlled precisely. The thermal mass of the top plate and the base plate together are much larger than anything else in the system. Once they are heated to a certain temperature, the heat that is transferred to the chips during flattening will be constant, irrespective of how you are doing the heating (oven, heating pad, etc). You would just need a thermometer for this.
-- The design could be stacked, for doing larger numbers of chips. Imagine a system where four sets of plates are stacked on top of each other, each with 25 chips. You could run 100 chips at a time.
-- Once designed, the CAD drawings could be uploaded to an online CNC company and anyone could order the identical parts, anywhere in the world.
------------------------------
Open questions:
1. How much weight / heat / time ? How heavy would the top and base plates need to be to be used effectively? Experimentation is needed to determine this.
2. Cost of the CNC milled parts. In principle, the design is very simple, and could be made from machined Aluminum or Brass. I doubt this would cost that much from an online CNC but I could be wrong.
------------------------------
So, could this be a new way of flattening chips? I think the idea has merits. Change my mind
Before you say it, I know there are other threads about chip flattening. The point of this thread will make itself clear, hopefully.
All of the commonly used chip flattening techniques are based on some variation of the "clamp" method - that is, put a barrel of warped chips in a clamp (possibly using ceramic blanks as spacers), tighten the clamp, and add heat. Wait for some time, re-tighten the clamp, remove the clamp from heat and allow to cool.
While this method is tried and tested, and no doubt works with some degree of success, it seems to have serious limitations. First of all, it's SLOW. The max number of chips that you can do at a time is one or two barrels, and the heating and cooling time also seems long. On top of that, it is very hard to control the parameters of the system, namely each person will tighten the clamp differently, and the chips will reach a different temperature depending on the particular oven or heating pad you are using, all depending on the air circulation around the chips because the chips are not actually in contact with anything which is thermally conductive.
HENCE, I am asking myself if there is a better way. A flattening method which would give reproducible results, and have a high enough throughput to flatten say 1000 chips in a couple of hours. Can it be done?
IF I know any group of people who are resourceful and goal driven, it's the chippers on this site. I'm sure it can be done. I even have an idea of how to do it. So, if you're interested, tell me what you think of this idea.
------------------------------
CONCEPT: Chip flattening device.
Working principle: Gravity.
Description: 1. Flat metal baseplate with circular recesses, each of which have a depth of ~ 1/2 a chip thickness. Places for 25 or 50 chips. 2. Flat metal top plate of matching size.
Operation: 1. Heat base plate and top plate in oven or on heat pad until a certain temperature is reached. 2. Place warped chips in circular recesses. 3. Place heavy metal top plate on top of chips. 4. Wait a certain period of time while chips are flattened by pressure of top plate, while absorbing heat from the two plates. 5. Remove chips.
------------------------------
What I like about the concept:
-- Gravity is doing the work - the force on the chips will always be the same, just the weight of the top plate. No variation due to how tight you tightened the clamp.
-- The heat can be controlled precisely. The thermal mass of the top plate and the base plate together are much larger than anything else in the system. Once they are heated to a certain temperature, the heat that is transferred to the chips during flattening will be constant, irrespective of how you are doing the heating (oven, heating pad, etc). You would just need a thermometer for this.
-- The design could be stacked, for doing larger numbers of chips. Imagine a system where four sets of plates are stacked on top of each other, each with 25 chips. You could run 100 chips at a time.
-- Once designed, the CAD drawings could be uploaded to an online CNC company and anyone could order the identical parts, anywhere in the world.
------------------------------
Open questions:
1. How much weight / heat / time ? How heavy would the top and base plates need to be to be used effectively? Experimentation is needed to determine this.
2. Cost of the CNC milled parts. In principle, the design is very simple, and could be made from machined Aluminum or Brass. I doubt this would cost that much from an online CNC but I could be wrong.
------------------------------
So, could this be a new way of flattening chips? I think the idea has merits. Change my mind

Last edited: